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Oneida Research Services, Inc.
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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
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      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
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    • Material Outgassing Analysis
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      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
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Mechanical Shock Testing

Mechanical shock testing looks at the effects of suddenly applied forces or abrupt changes in motion, which may disturb operating characteristics or cause damage, particularly if the shock vibrations are repetitive.

A mechanical shock test can determine the suitability of a device for use in electronic equipment that is subjected to moderately severe shocks from rough handling, transportation or field operation. Mechanical shock testing utilizes shock and drop testing and is considered destructive.

The Shock Apparatus is a commercial piece of mechanical shock equipment designed to provide a Half-Sine Shock Pulse. Typically, the device is subjected to 5 shock pulses of the peak (g) level specified in the selected test condition and for the pulse duration specified in each of the orientations X1, X2, Y1, Y2, Z1 and Z2. For devices with internal elements mounted with the major plane perpendicular to the Y-axis, the Y1 orientation shall be defined as the one in which the element tends to be removed from its mount. Typical conditions are 500g for 1.0 ms and/or 1500g for 0.5 ms.

Mechanical shock testing apparatus
  • Test Specifications / Standards
  • JESD22-B104
  • AEC-Q100
  • AEC-Q101
  • AEC-Q200
  • GR-468-CORE
  • MIL-STD-202 Method 213
  • MIL-STD-750 Method 2056
  • MIL-STD-883 Method 2002

Tooling is generally required to attach a component to the Shock Apparatus. The simplest and least expensive is to add holes to our existing adapter plates if the component has screw attachment holes. If the component has no such attachment means, special fixtures must be designed and fabricated. These unique fixtures are then attached to the mounting block. This unique design allows for the shock and vibration testing of all six axes.

Tooling allows the accelerometer to be mounted close to the centerline of the component being shocked. As standard practice, the new tooling will run dry (without test components) to calibrate the machine. Calibration is performed in all orientations before the product is run.

For more information on how shock and vibration can affect your device, contact our technical staff.

Contact ORS
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
      • Destructive Physical Analysis (DPA) Testing for PEMS
      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
      • Destructive Physical Analysis (DPA) Testing for Transistors
      • Destructive Physical Analysis (DPA) Testing of Magnetic Components
    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
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  • PCB Testing
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    • IPC-TM-650 A/B and D Coupon Testing
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  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
  • Intermittent Operating Life (IOL)
  • Optoelectronic Testing
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  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
    • SMD Preconditioning Test
    • Steam Aging
    • Temperature Cycling Testing
    • Temperature Humidity Testing
    • Temperature Storage Testing
    • Thermal Shock Testing
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Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
JEDEC
IEC
TELCORDIA
ICP
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Contact

1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

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IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
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New York

Corporate Headquarters
8282 Halsey Road
Whitesboro, NY 13492 USA

(315) 736-5480

New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

Colorado

8811 American Way, Suite 100
Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

France

Oneida Recherche Services

BP 163
06903 SOPHIA ANTIPOLIS Cedex
FRANCE

+33 4 92 92 88 89

European Office: DLA Suitability Letter

Pennsylvania

4201 Pottsville Pike
Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

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