Steam Aging / Solderability Testing

Steam Aging has been designed to artificially age electronic components and circuit boards, including high density discrete components.  Each day exposed to accelerated steam aging is equates to extended time spent in storage.  The steam aging process is often used in conjunction with solderability testing to determine if devices are able to meet the military and commercial Hi-Rel specifications of MIL-STD 202, Method 208.

Standards Compliance in Steam Aging Includes:

  • Mil-STD-202 Method 208
  • ANSI-J-STD-002
  • IPC/EIA J-STD 002D

Standards Compliance in Solderability Testing Includes:

  • ANSI-J-STD-002
  • MIL-STD-202 Method 208
  • MIL-STD-883
  • IPC/EIA J-STD 002D