Temperature Cycling or Thermal Cycle testing is performed on materials to determine the resistance of exposure to alternating extremes of high and low temperatures. Thermal mismatch of materials can cause solder joint cracking, warpage, damage to leads and markings, and hermetic seal failures.
Adhesives such as silicones, epoxies and polyurethanes can also be tested for thermal cycling resistance where the bonded materials may have different coefficients of thermal expansion and contraction. Conducting temperature cycling tests on these components will assist in determining:
The existence of thermal coefficient mismatches
The sensitivity of these mismatches to repeated temperature excursions
Oneida Research Services offers a range of temperature cycle test services to simulate different scenarios.
Power Temperature Cycle Test Specifications / Standards
MIL-STD-883 Method 1007
Test conditions vary based on the type of sample being tested. Specific cycling rates and other test conditions for components, boards, solder interconnects and/or tin whisker evaluations can be specified. The temperature cycle test is performed in chambers that control the number of cycles, dwell times, transfer times or ramp rates. Elevator-type chambers are used when ramp rates between the low and high temperature extremes must occur at a fairly rapid rate, like with MIL-STD-883 method 1010. If a slower ramp rate between temperature extremes is required, a single temperature cycle test chamber is best suited. By using a single-chamber piece of equipment, a specified, slower ramp (for example, 10°C per minute) can be set.
Power Temperature Cycle testing includes operationally electrically biasing devices under various conditions.
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