Component Analysis

Destructive Physical Analysis (DPA): Destructive Physical Analysis verifies and documents the quality of device processing steps to avoid defects that will adversely affect performance. By disassembling, testing and inspecting a device, a complete profile can be created to determine how well a device conforms to design and process requirements. ORS has been granted Laboratory Suitability to perform DPA testing on military devices per the test requirements found in Mil Std 750 and/or Mild Std 883.
Construction Analysis (CA): Construction analysis is a customized sequence of applicable analytical techniques to evaluate the inherent design and robustness of a component or assembly. A well-executed Construction Analysis examines and documents the physical characteristics including material elemental composition, dimensions and quality details of the assembly.
Failure Analysis (FA): Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer and manager, as well as the test and process engineers, to identify design, selection, test, and process deficiencies.
Ion Milling: Ion Milling is a precise type of a material ablation process performed on selected areas to expose underlying material without inducing significant mechanical stresses.
Particle Impact Noise Detection: Also known as PIND, this is the accepted method to detect particle contamination within an internal cavity; particle contamination may cause mechanical damage to internal circuitry leading to catastrophic damage.
Acoustic Microscopy: SAM is a non-destructive screening technique offering unique insight on the integrity of package and device construction. Its advantages include the detection of void formations, delaminations, cracks and fractures as well as other hidden internal defects within inherently susceptible materials and device types.
Steam Aging/Solderiblity: Steam aging is suitable for electronic components, circuit boards, discrete components and other items where artificial ageing needs to be tested for life failure evaluation. In conjunction with the aging process, solderablility testing can be used to verify that component leads and terminations are not adversely affected by long term storage.