Frequently Used DPA Methods


1018 Internal Gas Analysis (IGA)
1022 Resistance to Solvents
1071 Hermetic Seal
2017 Die Attach Integrity
2026 Solderability
2037 Bond Strength (Destructive Bond Pull Test)
2052 Particle Impact Noise Detection (PIND) Test
2068 External Visual for Nontransparent Glass-encased, Double Plug, Noncavity Axial Leaded Diodes
2069 Pre-cap Visual, Power MOSFETs
2070 Pre-cap Visual Microwave Descrete and Multichip Transistors
2071 Visual and Mechanical Examination
2072 Internal Visual Transistor (pre-cap) Inspection
2073 Visual Inspection for Die (Semiconductor Diode)
2074 Internal Visual Inspection (Discrete Semiconductor Diodes)
2076 Radiography
2077 Scanning Electron Microscope (SEM) Inspection of Metallization
2078 Internal Visual for Wire Bonded Diodes/Rectifiers
2101 Destructive Physical Analysis for Diodes
2102 Destructive Physical Analysis for Wire Bonded Devices


1014 Seal (Hermeticity)
1018 Internal Gas Analysis (IGA)
1034 Dye Penetrant Test (Dye Impregnation)
2003 Solderability
2009 External Visual
2010 Internal Visual (Monolithic)
2011 Bond Strength (Destructive Bond Pull Test)
2012 Radiography
2013 Internal Visual Inspection for DPA
2014 Internal Visual and Mechanical
2015 Resistance to Solvents
2017 Internal Visual (Hybrid)
2018 Scanning Electron Microscope (SEM) Inspections
2019 Die Shear Strength
2020 Particle Impact Noise Dection Test (PIND)
2021 Glassivation Layer Integrity
2030 Ultrasonic Die Attach Inspection
2032 Visual Inspection of Passive Elements
5009 Destructive Physical Analysis


9 Prohibited Materials Analysis
10.1 Capacitors, Fixed Ceramic
10.2 Capacitors, Fixed, Ceramic Chip
10.4 Capacitor, Fixed, Solid Tantalum
10.8 Capacitors, Fixed, Tantalum Slug, Wet Electrolyte
10.10 Capacitors, Variable, Piston Type, Sealed and Unsealed
10.11 Capacitor, Fixed, Solid Tantalum Chip Style
12.1 Crystal Units, Quartz
13.1 Diodes, Glass Bodied, Axial Leaded and Surface Mount
14.1 Filters, EMI, Low Pass, Feed-Through
15.1 Magnetic Devices, Inductors, and Transformers
15.2 Magnetic Devices, RF Coils
16.1 Micro circuits, Hermetic, Monolithic, Multichip, and Hybrids
16.3 Crystal Oscillators
17.1 Relays
18.3 Resistor, Metallized Film
18.4 Resistors, Fixed, Metal-Foil
18.5 Resistors, Fixed, Chip, Style RM
18.6 Resistor Networks
18.8 Resistors, Fixed, Wirewound, Power, and Wirewound Power, Chassis-Mounted
19.1 Switch, Snap Action
19.2 Thermal Switches
20.1 Thermistor, Glass Bodied, Hermetic
20.2 Thermistor, Disc and Bead Encapsulated
21.1 Transistors
23.2 Fuses, Glass and Ceramic Substrate Style